March 29, 2013 at 2:32 pm Leave a comment

BOND21 will be a very important event on Nanoscience and Engineering calendar will be annually and hosted first by UniMAP 2013. It represents the liaison and integration of three well-established international interface conferences:

  • ICNE (International Conference on Nanoelectronics and Education, led by Institute of Nano Electronic Engineering (INEE)),
  • ICNR (International Conference on Nanomaterials and Renewable Energy, led by Advanced Materials Research Center (AMREC)), and
  • ICGNM (International Conference on Green Nanotechnology Management, led by School of Technology Management and Logistics (STML)) and is organized by members of all 3 conferences.

Clearly, bond aspects are very important for nanoscience and engineering where high performance, high functionality and low cost are required. There are new-generation elements to accurately transfer other functionalities, such as electronic, electrical, thermal and optical properties, engineering, renewable energies and technology management on the micro- and nano level. The bond challenges brought novel elements based on nanoparticles, nanomaterials and natural materials need to be addressed in this context.

The community will be benefited enormously over the years through ICNE, ICNR and ICGNM events to understand the theory and application principles. BOND21 will tackle the issues of the advent of novel materials, structures and applications through a significant worldwide event. BOND21 represents the 21st conference in the area of nanoscience and engineering after the ICNE, ICNR and ICGNM events. BOND21 will be jointly co-organized by UniMAP (INEE), SIRIM (AMREC), UUM (STML), and UoA (Iraq).


Entry filed under: Uncategorized. AdhesivEngineer Group

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